Through Hole Ball and Socket on Oxley Inc.


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	Through Hole Ball and Socket
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		Snaplox® Printed Circuit Test Point (27) Features Award winning kinematic design allows rapid connection/disconnection. High retention force with socket (at angles less than 30°) and eight point contact ensures low contact resistance. Low detachment force with socket (at angles greater than 30°) reduces risk of inadvertent damage to pcb during test. Surface mount, self retaining and straight shank designs available. Hand or semi-automatic machine assembly. Details on request. Application Plated through hole, multilayer and ceramic and printed circuits and hybrids. Search Snaplox® Printed Circuit Test Point - 27 Items




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Through Hole Ball and Socket